TSMC selects IC’Alps for its Design Center Alliance (DCA)

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TSMC selects IC’Alps as a Design Center Alliance (DCA) member


0410 at TSMC OIP
At the TSMC OIP (04/10/2023)

The ASIC/SoC Design House is very proud to announce its integration to the TSMC Open Innovation Platform® and its program dedicated to Design Houses: Design Center Alliance.

The OIP aims to reduce design barriers and implementation time by providing tools and easier access to TSMC DCA members.

Lucille Engels, COO, IC'Alps

With many years of practice making integrated devices using TSMC technologies, this is an exciting milestone for IC’Alps and we are very proud to be part of TSMC Design Center Alliance. We support hereafter our common customers in their ASIC design with a reassurance of meeting their needs on performance, time-to-market and budget. We will strive to honour this position.



Our partnership with IC’Alps will benefit our mutual customers with its high-quality ASIC/SoC development services using TSMC’s industry-leading technologies, as well as IC’Alps’ experience with European markets. As a valuable design ecosystem partner, IC’Alps has extensive IC design expertise and will be able to help our customers accelerate silicon innovation for a wide range of emerging technologies.”


How will it impact our partners and customers?

Getting closer to TSMC by integrating the OIP’s DCA is not only good news for IC’Alps but also for our clients seeking innovation on TSMC technologies, as well as for our partners. This will enable, among other things:

  • A streamlined access to TSMC IP libraries and ecosystem
  • Simplified paperwork process
  • Enhanced manufacturing capabilities


More on TSMC’s website

TSMC selects IC'Alps for its Design Center

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