{"id":55960,"date":"2023-10-04T08:27:58","date_gmt":"2023-10-04T06:27:58","guid":{"rendered":"https:\/\/www.icalps.com\/?p=55960"},"modified":"2025-06-03T14:01:00","modified_gmt":"2025-06-03T12:01:00","slug":"tsmc-selects-icalps-for-its-design-center-alliance-dca","status":"publish","type":"post","link":"https:\/\/www.icalps.com\/fr\/tsmc-selects-icalps-for-its-design-center-alliance-dca\/","title":{"rendered":"TSMC selects IC’Alps for its Design Center Alliance (DCA)"},"content":{"rendered":"

TSMC selects IC’Alps as a Design Center Alliance (DCA) member<\/h2>\n

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At the TSMC OIP (04\/10\/2023)<\/figcaption><\/figure>\n

The ASIC\/SoC Design House is very proud to announce its integration to the TSMC Open Innovation Platform\u00ae and its program dedicated to Design Houses: Design Center Alliance.<\/p>\n

The OIP aims to reduce design barriers and implementation time by providing tools and easier access to TSMC DCA members.<\/p>\n\t\t

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With many years of practice making integrated devices using TSMC technologies, this is an exciting milestone for IC\u2019Alps and we are very proud to be part of TSMC Design Center Alliance. We support hereafter our common customers in their ASIC design with a reassurance of meeting their needs on performance, time-to-market and budget. We will strive to honour this position.<\/p>\n\t\t\t<\/p>\n\t\t\t\t\t\t\t

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Lucille Engels<\/strong><\/p>\n

Chief Operating Officer - IC\u2019Alps<\/p>\n<\/cite>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/blockquote>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\n

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Our partnership with IC\u2019Alps will benefit our mutual customers with its high-quality ASIC\/SoC development services using TSMC\u2019s industry-leading technologies, as well as IC\u2019Alps\u2019 experience with European markets. As a valuable design ecosystem partner, IC\u2019Alps has extensive IC design expertise and will be able to help our customers accelerate silicon innovation for a wide range of emerging technologies.\u201d<\/p>\n\t\t\t<\/p>\n\t\t\t\t\t\t\t

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Dan Kochpatcharin<\/strong><\/p>\n

Head of the Design Infrastructure Management Division - TSMC<\/p>\n<\/cite>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/blockquote>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\n

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How will it impact our partners and customers?<\/h2>\n

Getting closer to TSMC by integrating the OIP’s DCA is not only good news for IC’Alps but also for our clients seeking innovation on TSMC technologies, as well as for our partners. This will enable, among other things:<\/p>\n